Modelling and Optimization of Continual Laser Joining Processes for Silicon Aluminum Alloy in Microwave Devices

Due to its higher energy and smaller heating area, laser joining technology is widely used in aluminum alloy welding and other industrial fields, which meets the solder sealing requirements for electronic packaging.According to experiments, cracks were prone to occur at the corners and spot-welding positions near the weld.In this paper, the depth a

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